- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
Patent holdings for IPC class H01L 21/31
Total number of patents in this class: 3437
10-year publication summary
195
|
235
|
199
|
172
|
140
|
176
|
150
|
144
|
139
|
52
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tokyo Electron Limited | 11599 |
595 |
Kokusai Electric Corporation | 1791 |
347 |
Applied Materials, Inc. | 16587 |
184 |
Hitachi Kokusai Electric Inc. | 1070 |
143 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
133 |
Micron Technology, Inc. | 24960 |
91 |
Samsung Electronics Co., Ltd. | 131630 |
66 |
International Business Machines Corporation | 60644 |
46 |
Intel Corporation | 45621 |
46 |
ULVAC, Inc. | 1448 |
42 |
Texas Instruments Incorporated | 19376 |
41 |
Novellus Systems, Inc. | 559 |
40 |
Lam Research Corporation | 4775 |
39 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
38 |
United Microelectronics Corp. | 3921 |
35 |
ASM IP Holding B.V. | 1715 |
34 |
Fujikin Incorporated | 671 |
24 |
Kyocera Corporation | 12735 |
23 |
Intermolecular, Inc. | 310 |
23 |
Nissin Electric Co., Ltd. | 213 |
23 |
Other owners | 1424 |